IBM, Deca Launch Advanced Chip Packaging Line in Quebec

IBM has partnered with Deca Technologies to integrate Deca’s advanced M-Series Fan-out Interposer Technology (MFIT) and Adaptive Patterning into IBM’s high-volume advanced packaging facility in Bromont, Quebec. This collaboration aims to enhance IBM’s semiconductor packaging capabilities, particularly for AI, high-performance computing (HPC), and data center applications. The Bromont plant, one of North America's largest and most advanced chip assembly sites, has recently been expanded to serve as a hub for high-performance packaging and chiplet integration. Deca’s MFIT technology offers a cost-effective alternative to full silicon interposers, improving signal integrity, design flexibility, and scalability, which are critical for next-generation computing systems. The partnership reflects IBM's strategic focus on advancing semiconductor packaging to support AI and data center growth, potentially bolstering its position in the competitive technology sector. This move comes amid IBM’s broader corporate developments, including alliances with other tech companies and recent dividend increases, contributing to investor confidence despite market uncertainties.