Thales, Radiall, Foxconn Nears France Semiconductor Plant Talks

French defense company Thales, connector specialist Radiall, and Taiwanese manufacturer Foxconn have begun preliminary discussions to establish France's first outsourced semiconductor assembly and test (OSAT) facility. The planned plant aims to produce over 100 million System-in-Package (SiP) units annually by 2031, utilizing fan-out wafer level packaging technology to serve key European sectors such as aerospace, automotive, telecommunications, and defense. The project, with an expected investment exceeding €250 million, seeks to strengthen Europe's semiconductor manufacturing capabilities and technological sovereignty amid global supply chain concerns and strained transatlantic relations. This initiative is poised to attract further European industrial partners, enhancing collaboration between established European and Asian supply chain players. Details on the facility's location or final investment timeline have not been disclosed. The partnership aligns with broader EU efforts to promote domestic semiconductor production and reduce dependency on US technology firms.