Amkor Plans $2B Semiconductor Packaging Facility, 2,000 Jobs Arizona

Amkor Technology, Inc., a leading semiconductor packaging and test services company, announced plans to build a new $2 billion advanced packaging and test facility on a 104-acre site within the Peoria Innovation Core in Arizona. The Peoria City Council approved a land swap and amended development agreement, allowing construction to begin imminently with production expected by early 2028. This facility will create approximately 2,000 jobs and is poised to become the largest outsourced semiconductor packaging and test site in the U.S., supporting critical industries such as high-performance computing, communications, and automotive. Amkor's President and CEO, Giel Rutten, emphasized the project's strategic role in strengthening the U.S. semiconductor supply chain and meeting growing customer demand, including collaborations with key players like TSMC. The land acquisition was secured through a state land auction, with Peoria purchasing 835 acres to develop a broader tech industry hub, further enhancing the region's semiconductor ecosystem. This investment underscores Amkor's commitment to U.S.-based chip manufacturing and advancing semiconductor technology.