Xiaomi Begins Mass Production of 3nm XRing O1 Smartphone Chip

Xiaomi is set to unveil its XRing O1, a second-generation 3-nanometer mobile chip, marking a major milestone in its semiconductor ambitions after four years of development and an investment exceeding $1.87 billion. The chip will power upcoming devices including the Xiaomi 15S Pro smartphone and Xiaomi Pad 7 Ultra, with a launch event scheduled for May 22. Xiaomi's semiconductor initiative, relaunched after earlier setbacks in large-scale chip development, now involves a 2,500-strong R&D team and a commitment to invest at least 50 billion yuan over the next decade to advance its chip design capabilities. The XRing O1 employs advanced 3nm process technology, positioning Xiaomi as the fourth global company to release a 3nm mobile processor, following Apple, Qualcomm, and MediaTek, and signaling its intent to compete at the forefront of chip innovation. While Xiaomi has previously relied on third-party processors, this chip reflects a strategic move toward integrating chip design with software to optimize device performance. Industry experts recognize this achievement as a breakthrough for Chinese semiconductor technology, though challenges remain in commercializing the new chip effectively.