IMEC CEO Proposes Reconfigurable 3D AI Chips to Address Rapid AI Evolution

Imec, a leading semiconductor research firm based in Belgium, is advocating for the development of reconfigurable, three-dimensional AI chip architectures to keep pace with rapidly evolving AI software demands. CEO Luc Van den hove warns that traditional approaches focusing on specialized, raw-power chips risk becoming obsolete due to fast-moving AI algorithm innovation, creating stranded assets by the time hardware is ready. He proposes future chips built from versatile 'supercells'—building blocks that can be dynamically reconfigured through an on-chip network to adapt quickly to changing AI requirements. This approach relies on advanced three-dimensional stacking technology, where layers of logic and memory silicon are bonded together, a technique imec has significantly advanced and that will be featured in upcoming TSMC and Intel process nodes. While some companies like OpenAI have taken the risky and costly path of creating custom chips, Van den hove emphasizes that this is not economical for most players, highlighting the need for flexible, programmable AI hardware. Imec’s vision aims to overcome energy efficiency, cost, and development timeline challenges, enabling better alignment between AI hardware and software evolution across applications such as healthcare and autonomous driving.