Huawei MateBook Fold Uses SMIC 7nm Chip Amid US Curbs

Huawei's new MateBook Fold laptop is powered by the Kirin X90 chip, which is manufactured using SMIC's 7-nanometer N+2 process, an older technology that highlights China's lag behind global semiconductor leaders. Despite rumors of a more advanced 5nm-equivalent chip, TechInsights confirmed that SMIC has not yet achieved scalable production at that level, largely due to persistent U.S. export restrictions that block access to crucial extreme ultraviolet lithography equipment. These U.S. sanctions have hampered China's semiconductor progress, forcing reliance on less efficient deep ultraviolet lithography and limiting chip yields. Huawei is responding by pushing for a self-reliant technology ecosystem, integrating its Harmony operating system and moving away from U.S. suppliers like Intel and Qualcomm. Industry leaders like TSMC and Intel are advancing toward 2nm chip production, underscoring the multi-generation gap that Chinese chipmakers currently face. This technological gap poses strategic challenges for China’s ambitions in mobile, PC, and AI sectors, reflecting broader geopolitical tensions in the global tech supply chain.