Intel Plans Test Chips Rollout with New 14A Process

Intel announced that multiple customers plan to build test chips using its forthcoming 14A manufacturing process, signaling renewed interest in its foundry business as it seeks to better compete with industry leader TSMC. The 14A process will utilize advanced high-NA EUV technology and a new power delivery solution, with Intel providing early digital design kits to assist clients in chip design. CEO Lip-Bu Tan, recently appointed in March, emphasized transparency and client feedback as he leads a revamp of Intel’s foundry operations. Intel reiterated plans to ramp up production of its current 18A process, with manufacturing set to begin in Oregon and expand to Arizona this year. Broadcom and Nvidia previously tested the 18A process, and similar trial runs are expected for 14A before full-scale production to manage risks and costs. The moves mark Intel’s determination to regain competitiveness and attract new customers in the global chip manufacturing sector.