Amkor Breaks Ground on $7B Peoria Packaging Campus

Amkor broke ground on a two-phase, $7 billion advanced semiconductor packaging and test campus in Peoria, Arizona, on the Peoria Innovation Core near Lake Pleasant Parkway and Loop 303. The company says the campus will offer over 750,000 square feet of cleanroom space and create as many as 3,000 jobs, though some local reports cited a smaller figure. Amkor and state leaders described the site as the largest outsourced advanced packaging and test facility in the U.S., intended to serve major customers including Apple and NVIDIA and to complement TSMC’s Arizona fabs. The first manufacturing building is expected to be completed by mid-2027, with production beginning in early 2028. Amkor said the expanded investment is supported by the CHIPS for America program, the federal Advanced Manufacturing Investment Tax Credit, and state and local incentives. Elected officials from both parties, including Gov. Katie Hobbs, Peoria Mayor Jason Beck, and U.S. Sens. Mark Kelly and Ruben Gallego, attended the groundbreaking.